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Single-sided copper-aluminum composite panel
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Single-sided copper-aluminum composite panel
The company’s independently developed single-sided copper-aluminum composite plate/strip is produced using a hot-melt solid-liquid process, achieving a minimum eutectic layer thickness of just 0.3–1.0 μm between the copper and aluminum—significantly lower than the 15–50 μm typically obtained with conventional methods. This innovative process eliminates contact resistance between the materials, resulting in high bonding strength, along with added benefits such as being lightweight, safe, reliable, and highly versatile. The product is widely used in industries including new energy vehicles, energy storage, power communications, and decorative applications.
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